The I3G4250D is a low-power 3-axis angular rate sensor able to provide unprecedented stability at zero-rate level and sensitivity over temperature and time. It includes a sensing element and an IC interface capable of providing the measured angular rate to the application through a standard SPI digital interface. An I2C compatible interface is also available.
The sensing element is manufactured using a dedicated micromachining process developed by STMicroelectronics to produce inertial sensors and actuators on silicon wafers.
The IC interface is manufactured using a CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The I3G4250D has a selectable full scale (±245/±500/±2000 dps) and is capable of measuring rates with a user-selectable bandwidth.
The I3G4250D is available in a plastic land grid array (LGA) package and can operate within a temperature range of -40 °C to +85 °C.
i3g4250d是一种能在零利率水平和灵敏度温度和时间提供了前所未有的稳定性,低功耗三轴角速率传感器。它包括一个传感元件和一个能通过标准的SPI数字接口为应用程序提供了测量的角速率接口。一个I2C兼容接口也可。
传感元件是使用专用的微加工工艺由意法半导体硅片生产惯性传感器和执行器的制造。
IC接口是使用CMOS工艺,允许高层次的集成设计专用电路,调整到更好的匹配传感元件的特性制造。
有一个可选的i3g4250d全面(±245 / 500 / 2000±±DPS),能够根据用户选择的带宽测量速率。
在一个塑料的i3g4250d栅格阵列(LGA)封装和可能的温度范围内操作的40°C + 85°C.
Wide supply voltage: 2.4 V to 3.6 V
Selectable full scale (245/500/2000 dps)
I2C/SPI digital output interface
16-bit rate value data output
8-bit temperature data output
Two digital output lines (interrupt and data ready)
Integrated low- and high-pass filters with user-selectable bandwidth
Ultra-stable over temperature and time
Low-voltage-compatible IOs (1.8 V)
Embedded power-down and sleep mode
Embedded temperature sensor
Embedded FIFO
High shock survivability
Extended operating temperature range (-40 °C to +85 °C)
ECOPACK®, RoHS and “Green” compliant
主要特点
宽电源电压:2.4伏至3.6伏
可选全尺寸(245 / 500 / 2000的DPS)
I2C或SPI数字输出接口
16位速率值数据输出
8位温度数据输出
双数字输出线(中断和数据准备)
集成低通和高通滤波器,用户可选择带宽
超温和时间超稳定
低电压(1.8 V)兼容iOS
嵌入式电源和睡眠模式
嵌入式温度传感器
嵌入式FIFO
高冲击生存能力
扩展的工作温度范围(- 40摄氏度至85摄氏度)
®Ecopack,ROHS和“绿色”标准
I3G4250D电路图
I3G4250D 引脚图
I3G4250D 封装图
机箱;2、主板:AIMB-786G2:LGA1151第8代/9代IntelCorei7/i5/i3/Pentium/Celeron母板,VGA/DVI-D/DP支持
机箱;2、主板:AIMB-786G2:LGA1151第8代/9代IntelCorei7/i5/i3/Pentium/Celeron母板,VGA/DVI-D/DP支持
机箱;2、主板:AIMB-786G2:LGA1151第8代/9代IntelCorei7/i5/i3/Pentium/Celeron母板,VGA/DVI-D/DP支持
机箱;2、主板:AIMB-786G2:LGA1151第8代/9代IntelCorei7/i5/i3/Pentium/Celeron母板,VGA/DVI-D/DP支持
本篇测评由电子工程世界的优秀测评者“jf_99374259”提供。本文将介绍基于米尔电子MYD-YT113i开发板的G2D图像处理硬件调用和测试。MYC-YT113i核心板及开发板真正的国产核心板
机箱;2、主板:AIMB-786G2:LGA1151第8代/9代IntelCorei7/i5/i3/Pentium/Celeron母板,VGA/DVI-D/DP支持
ROHM面向工业设备用电源、太阳能发电功率调节器及UPS等的逆变器、转换器,开发出1200V耐压的400A/600A的全SiC功率模块“BSM400D12P3G002”和“BSM600D12P3G001”。
机箱;2、主板:AIMB-786G2:LGA1151第8代/9代IntelCorei7/i5/i3/Pentium/Celeron母板,VGA/DVI-D/DP支持
ISO7721 | INA125-DIE | INA215 | INA210-Q1 |
INA214-Q1 | INA303 | IIS2DH | INA188 |
INA214 | irf540 | INA213 | ir2110 |
IDC5Q | INA211 | INA210 | I3G4250D |
INA212-Q1 | INA826 | INA240 | IRF4905PBF |