制造商:Microchip
The MCP37D21-200 is a 14-bit pipelined A/D converter with a maximum sampling rate of 200 Msps. The high accuracy of over 74 dB Signal-to-Noise Ratio (SNR) and over 90 dB Spurious Free Dynamic Range (SFDR) enable high precision measurements of fast input signals. The device operates at very low power consumption of 490 mW at 200 Msps including LVDS digital I/O. Lower power saving modes are available at 80 mW for Standby and 33 mW for Shutdown. The MCP37D21-200 includes many digital processing features that simplify system design, cost and power usage. These include an integrated digital down-converter with onboard NCO, decimation filters for improved SNR, individual phase, offset and gain adjustment and a fractional delay recovery for time-delay corrections in multi-channel modes. Data is available through the serial DDR LVDS or parallel CMOS interface and configured via SPI. The device is available in the TFBGA-121 and VTLA-124 packages.
14-bit resolution 200 Msps maximum sampling rate Low power 490 mW operation at full sampling rate, including LVDS digital I/O Power saving modes of 80 mW during Standby and 33 mW during Shutdown >74 dBFS SNR at 200 Msps >90 dBFS SFDR at 200 Msps Integrated digital down-converter Decimation filters for improved SNR Phase, offset and gain adjustment of individual channels Fractional delay recovery for time-delay corrections in multi-channel operations (dual/octal-channel modes) Input channel bandwidth of 500 MHz Output data format in serial DDR LVDS or parallel CMOS Configuration via Serial Peripheral Interface (SPI) Industrial temperature range -40°C to +85°C Available in TFBGA-121 and VTLA-124 packages磁场 与普通光电倍增管(PMT)的使用相比,微通道板(Microchannel Plate,MCP)受到磁场的影响比较小。磁场对MCP使用影响的大小取决于磁场与MCP通道轴之间的方向。图1显示了
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MCP37D31-200 还具有内置抽取滤波器,用于提高 SNR、分数延迟恢复 (FDR)、相位/偏移和各个通道的增益调整以及 DDC。
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存储,一个简单的词汇,却保存了对于我们而言十分重要的数据。往期存储相关文章中,小编对对象存储、文件存储、云存储均有所阐述。为增加大家对存储的认识,本文将对MCP存储器以及MCP存储器的应用发展予以
当前给定的MCP的概念为:MCP是在一个塑料封装外壳内,垂直堆叠大小不同的各类存储器或非存储器芯片,是一种一级单封装的混合技术,用此方法节约小巧印刷电路板PCB空间。
当前给定的MCP的概念为:MCP是在一个塑料封装外壳内,垂直堆叠大小不同的各类存储器或非存储器芯片,是一种一级单封装的混合技术,用此方法节约小巧印刷电路板PCB空间。
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