MOSFET drivers that are capable of providing up to 1.5A of peak current while operating from a single 4.5V to 18V supply. There are three output configurations available; dual inverting (MCP14A0153), dual noninverting (MCP14A0154) and complementary (MCP14A0155). These devices feature low shoot-through current, matched rise and fall times, and short propagation delays which make them ideal for high switching frequency applications.
The MCP14A0153/4/5 family of devices offer enhanced control with Enable functionality. The active-high Enable pins can be driven low to drive the corresponding outputs of the MCP14A0153/4/5 low, regardless of the status of the Input pin. An integrated pull-up resistor allows the user to leave the Enable pins floating for standard operation.
High Peak Output Current: 1.5A (typical)
Wide Input Supply Voltage Operating Range:
4.5V to 18V
Low Shoot-Through/Cross-Conduction Current in Output Stage
High Capacitive Load Drive Capability:
1000 pF in 11.5 ns (typical)
Short Delay Times: 25 ns (tD1), 24 ns (tD2) (typical)
Low Supply Current: 750 μA (typical)
Low-Voltage Threshold Input and Enable with
Hysteresis
Latch-Up Protected: Withstands 500 mA Reverse
Current
Space-Saving Packages:
8-Lead MSOP
8-Lead SOIC
8-Lead 2x3 TDFN
MCP14A0155 封装图
MCP14A0155 封装图
MCP14A0155 封装图
MCP14A0155 封装图
MCP14A0155 封装图
MCP14A0155 封装图
型号 | 制造商 | 描述 | 购买 |
---|---|---|---|
MCP14A0155T-E/SN | UCC | 470 µF 6.3 V 铝电解电容器 径向,Can - SMD 105°C 时为 2000 小时 | 立即购买 |
MCP14A0155T-E/MS | Europe Chemi-Con | 470 µF 16 V 铝电解电容器 径向,Can - SMD 105°C 时为 2000 小时 | 立即购买 |
MCP14A0155T-E/MNY | - | - | 立即购买 |
MCP14A0155-E/MS | Nichicon | 10 µF 450 V 铝电解电容器 径向,Can 105°C 时为 12000 小时 | 立即购买 |
MCP14A0155-E/SN | HoneywellMicroelectronics&PrecisionSensors | 立即购买 |
Microchip MCP33131D-10 和 MCP33131D-05 支持在高温和高电磁环境下工作。它们分别是 1 Msps 和 500 ksps的全差分、符合 Q100 要求的 16 位
磁场 与普通光电倍增管(PMT)的使用相比,微通道板(Microchannel Plate,MCP)受到磁场的影响比较小。磁场对MCP使用影响的大小取决于磁场与MCP通道轴之间的方向。图1显示了
该产品是14AWG 2.5平方毫米规格的耐高温高压线,线芯为精细镀锡铜材质,不易氧化。线芯采用了互绞合缠绕的工艺,降低了信号干扰,提升了导电性能,允载电压为AC600V/DC3KV允载电流达到了55.6A。绝缘层为性能优良的硅胶材料,...
在本教程中,我们将DAC MCP4921 与 Microchip PIC16F877A 接口以进行数模转换。
“基于标准化的设计,这些模块可以帮助降低LTE连接的成本,从而帮助企业通过物联网获得竞争优势,” AT&T物联网解决方案高级副总裁Chris Penrose说。“我们的客户将能够更有效地部署各种物联网解决方案,并升级到Cat-M1。
当前给定的MCP的概念为:MCP是在一个塑料封装外壳内,垂直堆叠大小不同的各类存储器或非存储器芯片,是一种一级单封装的混合技术,用此方法节约小巧印刷电路板PCB空间。
硅表征数据用于确定非线性传感器的特性。从该数据中得出一个描述传感器典型性能的方程式。确定方程的相应系数后,这些系数将用于计算典型传感器非线性的补偿。
MIC3230 | MOCD213M | max232cse | MIC2755 |
MJD122 | MCP47FEB01 | MMBF4092 | MCP4911 |
MMBF5484 | MC10E156 | MC10EP56 | MCP9701 |
MRF24J40ME | MM1Z6V8 | MJ11016 | MCP3423 |
MAT14 | MIC4469 | MC74AC161 | MC10E1652 |