Key Features

• Bluetooth specification v4.0 compliant master and slave single-mode Bluetooth low energy network processor

• Embedded Bluetooth low energy protocol stack: GAP, GATT, SM, L2CAP, LL, RF-PHY

• Bluetooth low energy profiles provided separately

• Operating supply voltage: from 2.0 to 3.6 V

• 8.2 mA maximum TX current (@0 dBm, 3.0 V)

• Down to 1.7 µA current consumption with active BLE stack

• Integrated linear regulator and DC-DC step-down converter

• Up to +8 dBm available output power (at antenna connector)

• Excellent RF link budget (up to 96 dB)

• Accurate RSSI to allow power control

• Proprietary application controller interface (ACI), SPI based, allows interfacing with an external host application microcontroller

• Full link controller and host security

• High performance, ultra-low power Cortex-M0 32-bit based architecture core

• On-chip non-volatile Flash memory

• AES security co-processor

• Low power modes

• 16 or 32 MHz crystal oscillator

• 12 MHz ring oscillator

• 32 kHz crystal oscillator

• 32 kHz ring oscillator

• Compliant with the following radio frequency regulations: ETSI EN 300 328, EN 300 440, FCC CFR47 Part 15, ARIB STD-T66

• Available in QFN32 (5 x 5 mm) and WLCSP34 (2.66 x 2.56 mm) packages

• Operating temperature range: -40 °C to 85 °C

主要特点

蓝牙规范V4.0兼容的主从单模低功耗蓝牙网络处理器

嵌入式低功耗蓝牙协议栈：差距，关贸总协定、SM、L2CAP、LL、rf-phy

蓝牙低能量配置文件单独提供

操作电源电压：从2到3.6伏

8.2 mA最大TX电流（@ 0 dBm时，3 V）

到1.7µ与活跃的BLE堆栈的电流消耗

集成线性稳压器和DC-DC降压转换器

高达8 dBm的输出功率（在天线连接器）

出色的射频链路预算（高达96分贝）

允许功率控制准确的RSSI

专有的应用程序接口（ACI），基于SPI的，允许外部主机应用的微控制器接口

全链路控制器和主机安全

高性能、超低功耗的Cortex-M0 32位架构的核心

片上非挥发性快闪记忆体

AES安全协处理器

低功率模式

16或32兆赫晶体振荡器

12兆赫环形振荡器

32千赫晶体振荡器

32千赫环形振荡器

符合下列规定：300射频ETSI EN 328，EN 300 440，FCC cfr47部分15、ARIB std-t66

可在qfn32（5 x 5毫米）和wlcsp34（2.66×2.56毫米）封装

工作温度范围：- 40°为85°