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    首页产品索引NBSG72A

    NBSG72A

    购买收藏
     2 x 2 Crosspoint Switch, SiGe Differential, 2.5 V / 3.3 V, with Ouput Level Select

    制造商:ON

    中文数据手册

    产品信息

    The NBSG72A is a high-bandwidth fully differential 2 X 2 crosspoint switch with Output Level Select (OLS) capabilities. This is a part of the GigaComm family of high performance Silicon Germanium products. The device is housed in a low profile 3 X 3 mm 16-pin QFN package.
    Differential inputs incorporate internal 50 Ω termination resistors and accept NECL (Negative ECL), PECL (Positive ECL), LVCMOS/LVTTL, CML, or LVDS. The OLS input is used to program the peak-to-peak output amplitude between 0 and 800 mV in five discrete steps. The SELECT inputs are single-ended and can be driven with either LVECL or LVCMOS/LVTTL input levels.
    • Maximum Input Clock Frequency > 7 GHz Typical
    • Maximum Input Data Rate > 7 Gb/s Typical
    • 200 ps Typical Propagation Delay (OLS = FLOAT)
    • 55/45 ps Typical Rise/Fall Times (OLS = FLOAT)
    • Selectable Swing PECL Output with Operating Range: V
    • = 2.375 V to 3.465 V with V
    • = 0 V
    • Selectable Swing NECL Output with NECL Inputs with Operating Range: V
    • = 0 V with V
    • = −2.375 V to −3.465 V
    • Selectable Output Levels (0 mV, 200 mV, 400 mV, 600 mV or 800 mV Peak-to-Peak Output)
    • 50 Ω Internal Input Termination Resistors
    • Single−ended LVECL or LVCMOS/LVTTL Select Inputs (SELA, SELB)
    • Failure management system to automatically re-route data

    电路图、引脚图和封装图

    在线购买

    型号制造商描述购买
    NBSG72AMNR2GONCROSS POINT SWITCH, 2 CHANNEL 立即购买
    NBSG72AMNGONIC CROSSPOINT SW 1 X 2:2 16QFN 立即购买

    技术资料

    标题类型大小(KB)下载
    AC Characteristics of ECL DevicesPDF896 点击下载
    ECL Clock Distribution TechniquesPDF54 点击下载
    Designing with PECL (ECL at +5.0 V)PDF102 点击下载
    Odd Number Divide By Counters with 50% Outputs and Synchronous ClocksPDF90 点击下载
    Storage and Handling of Drypack Surface Mount DevicePDF49 点击下载
    Interfacing with ECLinPSPDF72 点击下载
    Termination of ECL Logic DevicesPDF176 点击下载
    Thermal Analysis and Reliability of WIRE BONDED ECLPDF119 点击下载

    应用案例更多案例

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