The MIC4123/4124/4125 family are highly reliable BiCMOS/DMOS buffer/driver/MOSFET drivers. They are higher output current versions of the MIC4126/4127/4128, which are improved versions of the MIC4426/4427/4428. All three families are pin-compatible. The MIC4123/4124/4125 drivers are capable of giving reliable service in more demanding electrical environments than their predecessors. They will not latch under any conditions within their power and voltage ratings. They can survive up to 5V of noise spiking, of either polarity, on the ground pin. They can accept, without either damage or logic upset, up to half an amp of reverse current (either polarity) forced back into their outputs.The MIC4123/4124/4125 series drivers are easier to use, more flexible in operation, and more forgiving than other CMOS or bipolar drivers currently available. Their BiCMOS/DMOS construction dissipates minimum power and provides rail-to-rail voltage swings.Primarily intended for driving power MOSFETs, the MIC4123/4124/4125 drivers are suitable for driving otherloads (capacitive, resistive, or inductive) which require low impedance, high peak currents, and fast switching times. Heavily loaded clocklines, coaxial cables, or piezoelectric transducers are some examples. The only known limitation on loading is that total power dissipated in the driver must be kept within the maximum power dissipation limits of the package.
Reliable, low-power bipolar/CMOS/DMOS construction
Latch-up protected to >200mA reverse current
Logic input withstands swing to -5V
High 3A peak output current
Wide 4.5V to 20V operating range
Drives 1800pF capacitance in 25ns
Short <50ns typical delay time
Delay times consistent with in supply voltage change
Matched rise and fall times
TTL logic input independent of supply voltage
Low equivalent 6pF input capacitance
Low supply current
3.5mA with logic 1 input
350µA with logic 0 input
Low 2.3Ω typical output impedance
Output voltage swings within 25mV of ground or VS.
'426/7/8-, '1426/7/8-, '4426/7/8-compatible pinout
Inverting, noninverting, and differential configurations
Exposed backside pad packaging reduces heat ePad SOIC-8L (θJA = 58°C/W) 4mm x 4mm MLF®-8L (θJA = 45°C/W)
MIC4123 封装图
MIC4123 封装图
MIC4123 封装图
MIC4123 封装图
型号 | 制造商 | 描述 | 购买 |
---|---|---|---|
MIC4123YML-TR | Other | LD39015M10R | 立即购买 |
MIC4123YME-TR | Vishay Sprague | 钽电容 7.00 x 6.00mm 2824 | 立即购买 |
MIC4123YME | - | - | 立即购买 |
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2019年1月14 日晚间,台湾工研院公告指出,“若是使用华为手机,自 1月15日中午起将无法使用本院的无线内部网络”,公告还通知员工,目前若有(或准备使用)与实验有关的华为设备,请马上与资科中心联系。
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