The MIC4123/4124/4125 family are highly reliable BiCMOS/DMOS buffer/driver/MOSFET drivers. They are higher output current versions of the MIC4126/4127/4128, which are improved versions of the MIC4426/4427/4428. All three families are pin-compatible. The MIC4123/4124/4125 drivers are capable of giving reliable service in more demanding electrical environments than their predecessors. They will not latch under any conditions within their power and voltage ratings. They can survive up to 5V of noise spiking, of either polarity, on the ground pin. They can accept, without either damage or logic upset, up to half an amp of reverse current (either polarity) forced back into their outputs.The MIC4123/4124/4125 series drivers are easier to use, more flexible in operation, and more forgiving than other CMOS or bipolar drivers currently available. Their BiCMOS/DMOS construction dissipates minimum power and provides rail-to-rail voltage swings.Primarily intended for driving power MOSFETs, the MIC4123/4124/4125 drivers are suitable for driving otherloads (capacitive, resistive, or inductive) which require low impedance, high peak currents, and fast switching times. Heavily loaded clocklines, coaxial cables, or piezoelectric transducers are some examples. The only known limitation on loading is that total power dissipated in the driver must be kept within the maximum power dissipation limits of the package.
Reliable, low-power bipolar/CMOS/DMOS construction
Latch-up protected to >200mA reverse current
Logic input withstands swing to -5V
High 3A peak output current
Wide 4.5V to 20V operating range
Drives 1800pF capacitance in 25ns
Short <50ns typical delay time
Delay times consistent with in supply voltage change
Matched rise and fall times
TTL logic input independent of supply voltage
Low equivalent 6pF input capacitance
Low supply current
3.5mA with logic 1 input
350µA with logic 0 input
Low 2.3Ω typical output impedance
Output voltage swings within 25mV of ground or VS.
'426/7/8-, '1426/7/8-, '4426/7/8-compatible pinout
Inverting, noninverting, and differential configurations
Exposed backside pad packaging reduces heat ePad SOIC-8L (θJA = 58°C/W) 4mm x 4mm MLF®-8L (θJA = 45°C/W)
MIC4123 封装图
MIC4123 封装图
MIC4123 封装图
MIC4123 封装图
型号 | 制造商 | 描述 | 购买 |
---|---|---|---|
MIC4123YML-TR | Other | LD39015M10R | 立即购买 |
MIC4123YME-TR | Vishay Sprague | 钽电容 7.00 x 6.00mm 2824 | 立即购买 |
MIC4123YME | - | - | 立即购买 |
高通的QCC304x及后续的芯片支持HybridANC,包含FFMIC和FBMIC。其中FFMIC可以与2-CVC中的副MIC共用同一个MIC,可以是数字MIC或者模拟MIC。但是如果是模拟MIC的话,因为ANC与CVC会共用FFMIC的模拟增益。
2019年1月14 日晚间,台湾工研院公告指出,“若是使用华为手机,自 1月15日中午起将无法使用本院的无线内部网络”,公告还通知员工,目前若有(或准备使用)与实验有关的华为设备,请马上与资科中心联系。
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在很多应用场合,要用到多MIC设计,比如AI语音识别,就要用到多个硅麦的设计,以提高语音识别的精准度,本人曾做过两个这样的项目,下面分享下设计心得,看到这篇文章的朋友如果觉得有所帮助的话,记得
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